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Capabilities

Layout for Fabrication and Characterization

 10,000 square foot facility including Class-100/1000 cleanroom and characterization space. Cleanroom is programmed for state of the art photolithography, metals and thin film deposition, wet and dry etch and capability of nano characterization.
20 Students can be trained at the same time in the Cleanroom.

Class 100/1000 (ISO Class 5/6) Cleanroom with full microfabrication tools for Nano/micro-electronics, MEMS and bio-medical devices fabrication. It contains 6” wafer handling capability from standard nanofabrication processing to packaging and characterization

Bay-1 Thim Film Area

  • Thermal Evaporator - PVD75  
  • E-beam Evaporator  - PVD75  
  • DC sputtering           - PVD75  
  • RF sputtering            - PVD75  
  • Thermal EVA             - NTE-3000  
  • Rapid Thermal Processor - RTP-600S 
  • Tube Furances No. 1 - ThermoFisher Lindberg/Blue   
  • Tube Furances No. 2 - ThermoFisher Lindberg/Blue   

     

Bay-2 Photo-lithography Area

  • Contact Mask Aligner -  OAI 800   
  • Contact Mask Aligner -  Karl Suss MJB4  
  • Microscope System for Digital Image
  • Cee 200CB Coat-Bake System No. 1, No. 2
  • Electrical Oven No 1, No 2.
  • Fume Hood No 1, No 2.
     

Bay-3 Plasma Etching Area

  • RIE          - Phantom RIE
  • RIE/ICP   - Minilock Phantom RIE ICP

     

Bay-4 On/Off line Training Room

  • Multimidia On/Off line Education System
     

Bay-5 Testing/Inspection Area

  • Microscope No 1.
  • Microscope No 2.
  • Microscope No 3.
  • Profilometer - KLA Tencor P-16+
     

Bay-6 Wet/Chemical Facilities Area

  • Fume Hood No 3.
  • Fume Hood No 4.
  • Chemical / Basis Storage Cabinet
  • Refrigerator for Chemical